Govt okays ₹7,172 cr Electronics Components Manufacturing Scheme proposals; launches India’s first edge SoC platform
Govt okays ₹7,172 cr Electronics Components Manufacturing Scheme proposals; launches India’s first edge SoC platform
The Ministry of Electronics and Information Technology has approved 17 new proposals under the Electronics Components Manufacturing Scheme, totaling ₹7,172 crore. This initiative is expected to generate ₹65,111 crore in production and create 11,808 jobs across nine states. Additionally, India launched its first edge SoC platform, marking a significant step in the country's semiconductor ecosystem.
The Electronics Components Manufacturing Scheme in India has greenlit 17 proposals, totalling ₹7,172 crore, to boost production and job creation across nine states. The launch of the first edge SoC platform signifies a major leap in India's semiconductor capabilities, aiming to enhance the country's electronics manufacturing landscape and global competitiveness.
After approving seven applications for ₹5,532 crore earlier, the Ministry of Electronics and Information Technology has approved 17 more proposals under the Electronics Components Manufacturing Scheme (ECMS) spanning across the country. The scheme, with a total investment worth ₹7,172 crore, is projected to have production of ₹65,111 crore, and could create 11,808 direct jobs. The approved units are spread across 9 states — Goa, Gujarat, Jammu & Kashmir, Karnataka, Madhya Pradesh, Maharashtra, Tamil Nadu, Uttar Pradesh, and Andhra Pradesh. The idea of approval across states is to create high-skill jobs beyond metro cities.
The 2nd tranche includes a wide range of components and sub-assemblies, such as: India’s first-ever optical transceiver (SFP) manufacturing facilities by Jabil Circuit India Private Limited and Zetchem Supply Chain Services Private Limited; oscillators for precise timing applications in communication devices, computers, and industrial electronics by Rakon India Private Limited; enclosures for laptops and smartwatches by Aequs Consumer Products Private Limited; camera modules by ASUX Safety Components India Private Limited, Uno Minda Limited, and Syrma Mobility Private Limited; connectors for electronic applications by TE Connectivity India Private Limited; and multi-layer PCBs by nine companies.
The companies selected for multi-layer PCBs are Hi-Q Electronics Private Limited, Secure Circuits Limited, Zetfab India Private Limited, Ehoome IOT Private Limited, Sierra Circuits (India) Private Limited, Meena Electrotech Private Limited, AT & S India Private Limited, Micropack Private Limited, and Infopower Technologies Private Limited.
These components serve key sectors including smartphones, IT hardware, wearables, telecom, EVs, industrial electronics, defence, medical electronics, and renewable energy. Minister of Electronics and IT Ashwini Vaishnaw, during an event organised by the India Cellular & Electronics Association (ICEA), said ECMS is unlocking the next phase of value chain integration, from devices to components and sub-assemblies, ensuring India’s electronics sector reaches $500 billion in manufacturing value by 2030-31.
The minister also launched the 1st Generation Energy-Efficient Edge Silicon Chip (SoC) (ARKA-GKT1), jointly developed by Cyient Semiconductors Pvt Ltd and Azimuth AI. The platform-on-a-chip SoC integrates advanced computing cores, hardware accelerators, power-efficient design, and secure sensing into a single chip, delivering up to 10x better performance while reducing cost and complexity. It supports smart utilities, cities, batteries, and industrial IoT, showcasing India’s shift toward a product-driven, high-performance semiconductor ecosystem. Vaishnaw also emphasised that “ECMS demonstrates India’s readiness to compete with global manufacturing powerhouses and showcases the country’s commitment to creating resilient and trusted supply chains.”