NITI Aayog unveils 10-year semiconductor roadmap; targets $120-150 billion value chain by 2035

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The roadmap is anchored around five strategic pillars — frontier research and design intellectual property, policy and investment support, production, and advanced packaging, talent development, and global partnerships with trusted nations and industry players. 

The roadmap also aligns with the priorities outlined under the India Semiconductor Mission 2.0 announced in the Union Budget 2026.
The roadmap also aligns with the priorities outlined under the India Semiconductor Mission 2.0 announced in the Union Budget 2026.

NITI Aayog on Friday unveiled India’s first comprehensive 10-year road map for the semiconductor sector, outlining a strategy to build a $120-150 billion semiconductor value chain by 2035 amid shifting global supply chains and rising focus on technological sovereignty. 

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The roadmap, titled 'Future of India’s Semiconductor Industry', was released by Finance Minister Nirmala Sitharaman and Electronics and IT Minister Ashwini Vaishnaw in the presence of Ashok Lahiri, Vice Chairman of NITI Aayog, and Debjani Ghosh, Distinguished Fellow at the policy body. 

Developed by the Frontier Tech Hub of NITI Aayog in consultation with industry and government stakeholders, the road map seeks to position India as a key node in the global semiconductor value chain. 

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The report noted that semiconductors have evolved beyond being industrial components and are now central to national security, economic resilience, digital sovereignty, and future competitiveness, powering sectors ranging from defence and telecom to artificial intelligence, healthcare, and advanced manufacturing. 

The roadmap is anchored around five strategic pillars — frontier research and design intellectual property, policy and investment support, production, and advanced packaging, talent development, and global partnerships with trusted nations and industry players. 

It outlines goals including making India a leading global destination for advanced packaging and outsourced semiconductor assembly and testing (OSAT), strengthening capabilities in compound semiconductors and wide-bandgap semiconductor manufacturing, and creating more than 100 advanced semiconductor design IPs. 

The roadmap also aligns with the priorities outlined under the India Semiconductor Mission (ISM) 2.0 announced in the Union Budget 2026, signalling a transition from ecosystem creation to ecosystem deepening across design, manufacturing, materials, packaging, research, and talent development. 

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Sitharaman said the roadmap represents India’s intent to move from being a large consumer of chips to becoming an indispensable part of the global semiconductor value chain. 

“Semiconductors are the foundational infrastructure of the 21st century. They power AI, electric mobility, telecommunications, defence systems, healthcare technology, digital public infrastructure and advanced manufacturing,” Sitharaman said. 

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She added that the roadmap focuses on emerging areas where India can build competitive strength, including advanced packaging, compound semiconductors, wide-bandgap materials and AI-native chip design. 

Vaishnaw said India’s strategy is focused on building the entire semiconductor ecosystem, spanning design, talent, materials, equipment fabrication and advanced packaging. “With ISM 2.0, design is our clear number one priority. We are strongly supporting Indian design companies so that their innovations can be manufactured and scaled within India,” Vaishnaw said. 

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Lahiri said semiconductor leadership would play a critical role in ensuring India’s technological independence in the future. 

Meanwhile, Ghosh said semiconductor leadership requires long-term planning and sustained investments, noting that countries which anticipate technological shifts early are better positioned to build enduring advantages.