Qualcomm partners Tata Electronics to manufacture automotive semiconductor modules in India

Qualcomm Technologies, Inc. has partnered with Tata Electronics to manufacture automotive semiconductor modules in India, in a move that strengthens local value addition in high-end vehicle electronics and deepens supply-chain diversification.

Under the agreement, Tata Electronics will produce Qualcomm Automotive Modules at its upcoming outsourced semiconductor assembly and test (OSAT) facility in Jagiroad, Assam. The greenfield unit, being developed with an investment of about $3 billion, is positioned as India’s first indigenous OSAT facility and is expected to cater to both domestic and global automakers.

Targeting software-defined vehicle architectures

The modules integrate system-on-chips from Qualcomm’s Snapdragon Digital Chassis platform with essential system components into production-ready units. These are deployed across digital cockpits, infotainment systems, connectivity solutions and intelligent vehicle architectures — segments witnessing rapid growth as automakers transition toward software-defined vehicles.

Nakul Duggal, EVP and Group GM, Automotive at Qualcomm Technologies, said expanding manufacturing capacity in key geographies is critical as the industry shifts to integrated, module-based platforms. “We will support automakers with scalable, high-performance solutions built in India,” he said.

The American tech giant had earlier stated it is betting big on the Indian market.

Savi Soin, Senior Vice President and President, Qualcomm India, added that local manufacturing will enhance supply-chain resilience and improve responsiveness to Indian and global OEM demand.

Strategic bet on semiconductor packaging

For Tata Electronics, the partnership marks a significant step in building scale in advanced semiconductor packaging. The company's CEO and MD Dr Randhir Thakur said the company will leverage its Integrated Systems Packaging capabilities to deliver high-performance automotive products for global markets.

The Assam facility will deploy technologies such as wire bond, flip chip and integrated systems packaging to serve applications across automotive, communications, IoT and AI.

The collaboration aligns with India’s broader push to build domestic semiconductor capacity under the “Make in India” initiative, while giving Qualcomm greater geographic diversification in its global automotive manufacturing network.